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  data she e t anti - sulfurated chip resi stors af122 (4pin/2r) / af124 (8pin/4r) / af16 2 ( 4 pin/ 2 r) / af164 (8pin/ 4r) 5%, 1% size s 2 0402, 4 x 0402, 2 x 0603, 4 x 0603 rohs compliant product s pecification C june 28, 2016 v.4
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 2 8 www.yageo.com jun. 28, 2016 v.4 y y a a g g e e o o b b r r a a n n d d o o r r d d e e r r i i n n g g c c o o d d e e global part number ( preferred ) af xx x - x x x xx xxxx l ( 1) (2) (3) (4) (5) (6) (7) (1) size 12 = 0402 x 2 (0404) 12 = 0402 x 4 (0408) 16 = 0603 x 2 (06 06 ) 16 = 060 3 x 4 (0612) (2) number of resistors 2 = 2 resistors 4 = 4 resistors (3) tolerance f = 1% j = 5% ( f or j umper ordering , use code of j ) (4) packaging t ype r = paper t aping r eel (5) temperature coeffici ent of resistance C = b ase on spec (6) ta ping reel 07 = 7 inch d ia. r eel 13 = 13 inch d ia. r eel (7) resistance v alue there are 2~4 digits indicated the resistor value. letter r/k/m is decimal point, no need to mention the last zero after r/k/m, e.g. 1k2 , not 1k20 . detailed resistance rules show in table of resista nce rule of global part number . (8) default code letter l is the system default code for ordering only. (note) ordering information - global part number & 12nc both part number s are identified by the series, size, tolerance, packing type , temperature coefficient, t aping reel and resistance valu e. s cope this specification describes af122/af124/ af162/ af164 (convex) series chip resist or arrays with lead - free terminations made by thick film process. applications ? terminal for sdram and ddram ? high - end co mputer & multimedia electronics in high sulfur environment ? consume electronic equipments: pdas, pnds ? mobile phone, telecom features ? aec - q200 qualified ? rohs compliant ? reducing environmentally hazardous wastes ? high component and equipment reliability ? savi ng of pcb space ? none forbidden - materials used in products /production ? halogen free epoxy ? moisture sensitivity level: msl 1 o rdering example the ordering code of a af 122 convex chip resistor array, value 1,000 with 5% tolerance, supplied in 7 - inch tape reel is: af122 - jr - 071kl . n ote 1. all our r - chip products meet rohs compliant. "lfp" of the internal 2d reel label mention s "lead free process" 2. on customized label, "lfp" or specific symbol printed and the op tional "l" at the end of global part number resistance rule of global part number resistance code rule example 0r 0r = jumper xrxx (1 to 9.76 ) 1r = 1 1r5 = 1.5 9r76 = 9.76 xxrx ( 10 to 97.6 ) 10r = 10 97r6 = 97.6 xxxr ( 100 to 976 ) 100r = 100 xkxx (1 to 9.76 k ) 1k = 1,000 9k76 = 9760 xm (1 m ) 1m = 1,000,000
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 3 8 www.yageo.com jun. 28, 2016 v.4 marking af122 / 162 no marking af124 / 164 i - digit marking 1% e - 24/e - 96: r R 100 4digits first three digits for significant figure and 4th digit for number of zeros 5% e - 24: r R 10 first two digits for significant figure and 3 rd digit for number of zeros for further marking information, please refer to data shee t chip resistors marking. construction the resistor is constructed on top of a high - grade ceramic body. internal metal electrodes are added on each end to make the contacts to the thick film resistive element. the composition of the resi stive element is a noble metal e mbedded into a glass and covered by a glass. the resistor is laser trimmed to the rated resistance value. the resistor is covered with a protective epoxy coat, finally the external termin ations (matte tin on ni - barrier) are added as shown in fig. 4. fig. 1 o o u u t t l l i i n n e e s s fig. 4 chip resistor outlines dimensions type af122 af124 af162 af164 b ( mm ) 0.24 0.10 0.2 5 0.15 0.35 0.10 0.35 0.15 h ( mm ) 0.30+0.10/ - 0.0 5 0.45 0.05 0.30 0.10 0.65 0.05 h 1 ( mm ) --- 0.30 0.05 -- 0.50 0.15 p (mm) 0.67 0.05 0.50 0.05 0.80 0.05 0.80 0.05 l (mm) 1.00 0.10 2.00 0.10 1.60 0.10 3.20 0.15 t (mm) 0.30 0.10 0.45 0.10 0.40 0.10 0.60 0.10 w 1 ( mm ) 0.25 0.10 0.30 0.15 0.30 0.10 0.30 0.15 w 2 ( mm ) 1.00 0.10 1.00 0.10 1.60 0.10 1.60 0.15 table 1 fig. 2 value = 0 fig. 3 value = 240k fig. 3 value = 316k af122 / 162 af12 4 / 164 for dimension, please refer to table 1 fig. 5 af122 /124/162/164 series chip resistors dimension 0 3 60
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 4 8 www.yageo.com jun. 28, 2016 v.4 footprint and solder ing profiles for recommended footprint and soldering profiles, please refer to data sheet chip resistors mounting . electrical character istics characteristics af122 af124 af162 af164 operating temperature r ange C 55 c to + 1 5 5 c C 55 c to + 1 5 5 c C 55 c to + 1 5 5 c C 55 c to + 1 5 5 c rated power 1/ 16 w 1/ 16 w 1/16w 1/16w maximum w orking v oltage 50 v 25 v 50v 50v maximum o verload v oltage 10 0 v 5 0 v 100v 100v dielectric w ithstanding v oltage 10 0 v 10 0 v 100v 100v resistance r ange 5% (e24 ) 1 to 1 m 1% ( e24/ e96) 10 to 1 m jumper < 5 0 m 5% (e24 ) 1 to 1 m 1% ( e24/ e96) 1 to 1 m jumper < 5 0 m 5% (e24 ) 1 to 1 m 1% ( e24/ e96) 1 to 1 m jumper < 5 0 m 5% (e24 ) 1 to 1 m 1% ( e24/ e96) 1 to 1 m jumper < 5 0 m temperature c oefficie nt 1 r 10 25 0 ppm/ c 10 r 1 m 20 0 ppm/ c 25 0 ppm/ c jumper criteria rated current 0.5 a rated current 1.0 a rated current 1.0 a rated current 1.0a maximum current 1.0 a maximum current 2.0 a maximum current 2.0 a maximum cur rent 2.0a table 2 packing style and pa ckaging quantity packing style reel dimension af122 af124 af162 af164 p aper taping r eel (r) 7" (178 mm ) 10 ,000 units 10 ,000 units 5 ,000 units 5 ,000 units 13" (330 mm) 5 0,000 units 4 0,000 units --- 2 0,000 units note 1. for paper tape and reel specification/dimensions, please refer to data sheet chip resistors p acking . table 3 packing style and packaging quantity schematic fig. 6 equivalent circuit diagram for dimension, please refer to fig. 5 and table 1
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 5 8 www.yageo.com jun. 28, 2016 v.4 fig. 7 maximum dissipation (p) in percentage of rated power as a function of the operating ambient temperature (t amb ) functional descripti on p p o o w w e e r r r r a a t t i i n n g g af122 / af124 / af162 / af164 rated power at 7 0 c is 1/16 w r ated v oltage the dc or ac (rms) continuous working voltage corresponding to the rat ed power is determined by the following formula: v= or max. working voltage whichever is less where v=continuous rated dc or ac (rms) working voltage (v) p=rated power (w) r=resistance value ( ? ) r) x (p
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 6 8 www.yageo.com jun. 28, 2016 v.4 tests and requiremen ts test test method procedure requirements life/ endurance mil - std - 202 - method 108 iec 60115 - 1 4.25 1 , 000 hours at 70 2 c applied rcwv 1.5 h ours on, 0.5 h our off, still air required (2%+0.05 ) < 100 m for jumper high temperature exposure mil - std - 202 - method 108 1 , 000 hours at maximum operating temperature depending on spec ification, u npowered tolerances: 1 5 5 3 c (1%+0.05 ) < 50 m for jumper moisture resistance mil - std - 202 - method 106 each temperature / humidity cycle is defined at 8 h ours (method 106 g ), 3 cycles / 24 h ours for 10d with 25 c / 65 c 95% r.h, without steps 7a & 7b, u npowered parts mounted on test - boards, without condensation on parts measurement at 24 2 hours after test co nclusion (2%+0.05 ) < 100 m for jumper thermal shock mil - std - 202 - m ethod 107 - 55/+125 c note: n umber of cycles required is 300. devices mounted maximum transfer time is 20 seconds. dwell time is 15 minutes. air C air (1%+0.05 ) < 50 m for jumper short t ime o verload i ec601 1 5 - 1 4 .13 2.5 times rcwv or maximum overload voltage whichever is less for 5 sec at room temp erature (2%+0.05 ) < 50 m for jumper no visible damage board flex/ bending iec60115 - 1 4.33 d evice mounted on pcb test board as described, only 1 board be nding required 3 mm bending b ending time : 60 5 s econds o hmic value checked during bending (1%+0.05 ) < 50 m for jumper no visible damage table 4 test condition, procedure and requirements
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 7 8 www.yageo.com jun. 28, 2016 v.4 test test method procedure requirements solderability - wetting j - std - 002 test b electrical test not required magnification 50x smd c onditions: 1 st step : method b, aging 4 h ours at 155 c dry heat 2 nd step : leadfree solder bath at 245 3 c dipping time: 3 0.5 seconds well tinned ( 95% covered) no visible damage - leaching j - std - 002 t est d leadfree solder, 260 c, 30 seconds immersion time no visible damage - resistance to soldering heat iec 60115 - 1 4.18 mil - std - 202 method 21 5 condition b, no pre - heat of samples leadfree solder, 2 6 0 c, 10 s econds immersion time procedure 2 for smd: devices fluxed and cleaned with isopropanol (1%+0.05 ) < 50 m for jumper no visible damage fos astm - b - 809 - 95* *modified sulfur 75 0 hours, 105 , unpowered (4.0%+0.05 ) <100m for jumper
series af 122/124 /162/164 (rohs compliant) chip resistor su r f ac e mount product specification 8 8 www.yageo.com jun. 28, 2016 v.4 revision histo ry yageo reserves all the rights for revis ing the content of this datasheet without further notification, as long as the products itself are u nchanged. any product change will be announced by pcn. revision date change notification description version 4 jun. 2 3 , 2016 - - aec - q200 qualified version 3 nov. 17, 2015 - - add in af16 2 version 2 may 29,2015 - - add in af164 version 1 aug. 15, 2014 - - update af124 dimensions version 0 oct. 02, 2013 - - first issue of this specification


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